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The form and structure of the LED chip packaged into a light emitting diode
Dec 24, 2018

First: soft package - the chip is directly bonded to a specific PCB printed board, connected to a specific character or display form by a bonding wire, and the LED chip and the bonding wire are protected by a transparent resin and assembled in a specific casing. This type of package is often used in digital display, character display or point display products.

Second: photoelectric lead type package - common is to fix the LED chip on the 2000 series lead frame, after soldering the electrode lead, it is encapsulated into a certain transparent shape with epoxy resin to become a single LED device. Such pins or packages can be divided into φ3 and φ5 diameter packages according to their external dimensions. The characteristics of this kind of package is to control the distance from the chip to the light-emitting surface, and various light-emitting angles can be obtained: 15°, 30°, 45°, 60°, 90°, 120°, etc., and the side illumination requirements can also be obtained. It is easier to automate production.

Third: micro-packages are patch packages - the LED chips are bonded to the micro-lead frame, and after the electrode leads are soldered, the light-emitting surface is generally encapsulated with epoxy resin.

Forth: in-line package - a chip mounted with a copper lead frame similar to an IC package, soldered with electrode leads and sealed with a transparent epoxy, common with a variety of different cavities in the "piranha" package and super In the piranha type package, this packaged chip has better heat dissipation and low thermal resistance. The input power of the LED can reach 0.1W~0.5W, which is larger than the lead type device, but the cost is higher.

Fifth: power package - power LED package is also a lot, it is characterized by a large bottom cavity of the bonding chip, and has specular reflection capability, high thermal conductivity, and low enough thermal resistance to make the chip The heat is quickly introduced outside the device, keeping the chip at a low temperature difference from the ambient temperature.